IP Library › Assignment 011814/0979
Patent Assignment
Reel/Frame 011814/0979

Assignment of Assignor's Interest

Recorded: 2001-05-15 Received: 2001-05-23 Pages: 3
Assignors
KUWABARA, OSAMU
Executed: 2001-05-07
WAKABAYASHI, TAKESHI
Executed: 2001-05-07
Assignee
INTEGRATED ELECTRONICS & PACKAGING TECHNOLOGIES, INC.
550-1, HIGASHIASAKAWAMACHI, HACHIOJI-SHI, TOKYO, JPX, JAPAN
Covered Property (1)
Semiconductor Device and Method of Manufacturing the Same
Application: 09/858,230 →