Patent Assignment
Reel/Frame 011819/0627
Assignment of Assignor's Interest
Recorded: 2001-05-17
Received: 2001-05-24
Pages: 5
Assignee
KSW MICROTEC GESELLSCHAFT FUR ANGEWANDTE MIKROTECHNIK MBD DRESDEN
GOSTRITZER STRASSE 63, D-01217 DRESDEN, DEX, GERMANY
Covered Property
(1)
Two-dimensional support for semiconductor chips, and a method for producing such a two- dimensional support
Application:
09/807,570 →