Patent Assignment
Reel/Frame 011820/0185
Assignment of Assignor's Interest
Recorded: 2001-05-21
Received: 2001-05-24
Pages: 6
Assignors
STEFANESCU, ANDREI
Executed: 2001-05-08
WILSON, GREGORY M.
Executed: 2001-05-08
TORACK, THOMAS A.
Executed: 2001-05-10
VASAT, JIRI L.
Executed: 2001-05-10
Assignee
MEMC ELECTRONIC MATERIALS, INC.
P.O. BOX 8, 501 PEARL DRIVE, ST. PETERS, MO, 63376, UNITED STATES
Covered Properties
(2)
Thermal annealing process for producing silicon wafers with improved surface characteristics
Application:
60/280,035 →
Micropump
Application:
09/817,309 →