Patent Assignment
Reel/Frame 011854/0703
Assignment of Assignor's Interest
Recorded: 2001-05-25
Received: 2001-06-07
Pages: 3
Assignor
MIYAZAKI, TAKASHI
Executed: 2001-05-22
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME MINATO-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Flip Chip Type Semiconductor Device and Method of Manufactruing the Same
Application:
09/866,404 →