Patent Assignment
Reel/Frame 011859/0853
Assignment of Assignor's Interest
Recorded: 2001-06-04
Pages: 2
Assignors
PRAKASH, SHIVA
Executed: 2001-04-25
GANAPATHI, SRINIVASAN K.
Executed: 2001-04-23
GLUCK, RANDOLPH S.
Executed: 2001-04-23
HOVEY, STEVEN H.
Executed: 2001-04-25
Assignee
FIDELICA MICROSYSTEMS, INC.
423 DIXON LANDING ROAD, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Use of Multi-Layer Thin Films as Stress Sensors
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Feb 22, 2007
From: FIDELICA MICROSYSTEMS, INC.
To: SPRING WORKS, LLC
Reel/Frame 018917/0401 →
Assignment of Assignor's Interest
Aug 6, 2008
From: FIDELICA MICROSYSTEMS, INC.
To: SPRINGWORKS, LLC
Reel/Frame 021344/0093 →
Release of Security Interest
Aug 12, 2008
From: SPRINGWORKS, LLC
To: FIDELICA MICROSYSTEMS, INC.
Reel/Frame 021371/0207 →
Assignment of Assignor's Interest
Dec 1, 2012
From: SPRINGWORKS, LLC
To: PALIOS CORPORATION
Reel/Frame 029389/0406 →
Assignment of Assignor's Interest
Jun 26, 2013
From: PALIOS CORPORATION
To: LENOVO PC INTERNATIONAL LIMITED
Reel/Frame 030694/0540 →