IP Library Assignment 011879/0737
Patent Assignment
Reel/Frame 011879/0737

Assignment of Assignor's Interest

Recorded: 2001-05-30 Received: 2001-06-13 Pages: 3
Assignors
SCHOENBORN, PHILIPPE
Executed: 2001-05-23
KIM, YONG-BAE
Executed: 2001-05-25
ZHANG, KAI
Executed: 2001-05-25
Assignee
LSI LOGIC CORPORATION
1551 MCCARTHY BOULEVARD, MILPITAS, CA, 95035, UNITED STATES
Covered Properties (2)
Sloped Sidewall via for Integrated Circuit Structure to Suppress via Poisoning and Process for Forming Same
Application: 09/870,851 →
Apparatus and Methods for Wave Soldering
Application: 09/802,197 →