Patent Assignment
Reel/Frame 011890/0604
Assignment of Assignor's Interest
Recorded: 2001-06-06
Received: 2001-06-18
Pages: 2
Assignee
CHI MEI OPTOELECTRONICS CORP.
NO. 1, CHI-YEH ROAD, TAINAN SCIENCE-BASED INDUSTRIAL PARK, TAINAN COUNTY, TAIWAN, TWX, TAIWAN
Covered Property
(1)
Tape automated bonding for packing connection band of flat display
Application:
09/875,731 →