IP Library Assignment 011899/0296
Patent Assignment
Reel/Frame 011899/0296

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2001-06-13 Received: 2001-06-21 Pages: 3
Assignors
FUNAKOSHII, MASASHI
Executed: 2001-06-06
HAMATANI, TSUYOSHI
Executed: 2001-06-06
MORIKAWA, TAKESHI
Executed: 2001-06-06
NAKABAYASHI, YUKIO
Executed: 2001-06-06
UTSUMI, MASAKI
Executed: 2001-06-06
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006, OAZA KADOMA, KADOMA-SHI, OSAKA 571-8501, JPX, JAPAN
Covered Application (1)
LEAD FRAME AND METHOD FOR FABRICATING RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE USING THE SAME
App. No. 09/879,082