Patent Assignment
Reel/Frame 011954/0152
Assignment of Assignor's Interest
Recorded: 2001-06-29
Received: 2001-07-12
Pages: 2
Assignors
TSUJIKAWA, SHIMPEI
Executed: 2001-06-01
USHIYAMA, MASAHIRO
Executed: 2001-06-06
MINE, TOSHIYUKI
Executed: 2001-06-11
YUGAMI, JIRO
Executed: 2001-06-12
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME CHIYODA-KU, TOKYO, JPX, JAPAN
Covered Properties
(2)
Semiconductor Device and Production Method Thereof
Application:
09/894,132 →
Damper Assembly Having Improved Strength Characteristics
Application:
09/892,091 →