Patent Assignment
Reel/Frame 012005/0765
Assignment of Assignor's Interest
Recorded: 2001-07-13
Received: 2001-07-30
Pages: 3
Assignor
MIYAZAKI, TAKASHI
Executed: 2001-07-06
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME MINATO-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Semiconductor Device Having Heat Spreader Attached Thereto and Method of Manufacturing the Same
Application:
09/905,141 →