IP Library Assignment 012018/0172
Patent Assignment
Reel/Frame 012018/0172

Assignment of Assignor's Interest

Recorded: 2001-07-24 Received: 2001-08-02 Pages: 2
Assignor
ICHINOSE, MICHIHIKO
Executed: 2001-07-11
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Property (1)
Semiconductor Device and Packaging Method Thereof
Application: 09/910,899 →