Patent Assignment
Reel/Frame 012018/0172
Assignment of Assignor's Interest
Recorded: 2001-07-24
Received: 2001-08-02
Pages: 2
Assignor
ICHINOSE, MICHIHIKO
Executed: 2001-07-11
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Semiconductor Device and Packaging Method Thereof
Application:
09/910,899 →