Patent Assignment
Reel/Frame 012033/0062
Assignment of Assignor's Interest
Recorded: 2001-07-30
Received: 2001-08-07
Pages: 2
Assignor
PENDSE, RAJENDRA D.
Executed: 2001-06-16
Assignee
CHIPPAC, INC.
3151 CORONADO DRIVE, SANTA CLARA, CA, 95054, UNITED STATES
Covered Properties
(3)
Wide Data Path Stacking System and Method
Application:
09/916,625 →
A Method of Forming a Flip Chip Interconnection Structure
Application:
09/802,664 →
Novel Uses of Mammalian CCR8 Receptors and Related Reagents
Application:
09/780,724 →