Patent Assignment
Reel/Frame 012039/0865
Assignment of Assignor's Interest
Recorded: 2001-07-31
Pages: 3
Assignors
JEONG, CHANG-OH
Executed: 2001-07-27
LEE, JAE-GAB
Executed: 2001-07-27
CHO, BEOM-SEOK
Executed: 2001-07-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, PALDAL-KU, SUWON CITY KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Wiring Line Assembly for Thin Film Transistor Array Substrate and a Method for Fabricating the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.