Assignment of Assignor's Interest

Recorded: 2001-08-27 Received: 2001-09-07 Pages: 3

Assignors

CHIH, HSU PO

Executed: 2001-08-17

TZU, JOHNSON C.H.

Executed: 2001-08-20

Assignee

SAMPO SEMICONDUCTOR CORPORATION

1F. 1, KAO-PING, SEC. CHUNG-FENG ROAD, LUNG TAN, TAO YUAN, TWX, R.O.C, TAIWAN

Covered Property (1)

Apparatus for packing semiconductor die

Application: 09/940,736 →