Patent Assignment
Reel/Frame 012130/0413
Assignment of Assignor's Interest
Recorded: 2001-08-27
Received: 2001-09-07
Pages: 3
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Resin encapsulated BGA-type semiconductor device
Application:
09/940,249 →