Patent Assignment
Reel/Frame 012191/0714
Assignment of Assignor's Interest
Recorded: 2001-09-24
Received: 2001-09-27
Pages: 3
Assignors
PENDSE, RAJENDRA D.
Executed: 2001-06-16
KAMEZOS, MARCOS
Executed: 2001-06-18
BUSH, WALTER A. JR.
Executed: 2001-08-15
Assignee
CHIPPAC. INC.
3151 CORONADO DRIVE, SANTA CLARA, CA, 95054, UNITED STATES
Covered Property
(1)
Flip Chip-in-Leadframe Package and Process
Application:
09/802,443 →