Patent Assignment
Reel/Frame 012201/0626
Assignment of Assignor's Interest
Recorded: 2001-09-14
Pages: 3
Assignors
MALLARI, JONATHAN C.
Executed: 2001-08-24
CHUNG, VINH
Executed: 2001-08-24
SNYDER, SUZANNE M.
Executed: 2001-08-27
Assignee
NEAH POWER SYSTEMS, INC.
22118 20TH AVENUE SOUTHEAST, BOTHELL, WASHINGTON, 98021
Covered Property
(1)
Wafer bonding methods and support structures associated with silicon-based and/or sol-gel derived fuel cell electrode stack assemblies
Application:
60/291,202 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.