Patent Assignment
Reel/Frame 012203/0352
Correction to Second Assignee Misspelled
Recorded: 2001-10-03
Pages: 3
Assignors
MATSUO, ITARU
Executed: 2001-03-30
RYU, HIROSHI
Executed: 2001-03-30
MIYAMURA, KAYO
Executed: 2001-03-30
Assignees
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-8, JAPAN
RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION
4-1, MIZUHARA, ITAMI-SHI, HYOGO, 664-0, JAPAN
Covered Property
(1)
Method of Manufacturing a Substrate with Directionally Anisotropic Warping