Patent Assignment
Reel/Frame 012206/0196
Assignment of Assignor's Interest
Recorded: 2001-09-24
Received: 2001-10-03
Pages: 3
Assignors
KATO, YUICHIRO
Executed: 2001-08-23
MITOMO, KENJI
Executed: 2001-08-23
SATO, TATSUYA
Executed: 2001-08-23
Assignee
HITACHI ELECTRONICS ENGINEERING CO., LTD.
SHIBUYA-KU, 16-3, HIGASHI 3-CHOME, TOKYO, JPX, JAPAN
Covered Property
(1)
Apparatus and Method for Inspecting Surface of Semiconductor Wafer or the Like
Application:
09/961,513 →