Patent Assignment
Reel/Frame 012224/0709
Assignment of Assignor's Interest
Recorded: 2001-09-25
Received: 2001-10-11
Pages: 2
Assignor
HACHISUKA, ATSUSHI
Executed: 2001-08-02
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
CHIYODA-KU, 2-3, MARUNOUCHI, 2-CHOME, TOKYO 100-8310, JPX, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Device and Semiconductor Device Manufactured Thereby
Application:
09/960,974 →