Patent Assignment
Reel/Frame 012230/0973
Assignment of Assignor's Interest
Recorded: 2001-10-03
Received: 2001-10-12
Pages: 3
Assignee
DENSE-PAC MICROSYSTEMS, INC.
7321 LINCOLN WAY, GARDEN GROVE, CA, 92841, UNITED STATES
Covered Property
(1)
Chip Stack with Differing Chip Package Types
Application:
09/912,010 →