Patent Assignment
Reel/Frame 012231/0308
Assignment of Assignor's Interest
Recorded: 2001-10-05
Received: 2001-10-12
Pages: 3
Assignors
MATSUI, HIROYUKI
Executed: 2001-09-10
MATSUKI, HIROHISA
Executed: 2001-09-10
MIYAJIMA, MOTOSHU
Executed: 2001-09-10
MIZUKOSHI, MASATAKA
Executed: 2001-09-10
MIZUTANI, AKIYO
Executed: 2001-09-10
OHNO, TAKAO
Executed: 2001-09-10
OTAKE, KOKI
Executed: 2001-09-10
WATANABE, EIJI
Executed: 2001-09-10
YOSHIDA, EIJI
Executed: 2001-09-10
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA 211-8588, JPX, JAPAN
Covered Properties
(2)
Solder Jointing System, Solder Jointing Method, Semiconductor Device Manufacturing Method, and Semiconductor Device Manufacturing System
Application:
09/970,802 →
Modeling Continuous Properties on Discontinuous Surfaces
Application:
09/927,417 →