Patent Assignment
Reel/Frame 012244/0177
Corrective Assignment to Correct the Name of Assigee That Was Previously Recorded on Reel 011819, Frame 0627.
Recorded: 2001-10-05
Received: 2001-10-17
Pages: 5
Assignee
KSW MICROTEC GESELLSCHAFT FUR ANGEWANDTE MIKROTECHNIK MBH DRESDEN
GOSTRITZER STRASSE 63, D-01217 DRESDEN, DEX, GERMANY
Covered Properties
(2)
Two-dimensional support for semiconductor chips, and a method for producing such a two- dimensional support
Application:
09/807,570 →
Mechanical Housing
Application:
09/804,129 →