Patent Assignment
Reel/Frame 012267/0596
Assignment of Assignor's Interest
Recorded: 2001-10-17
Received: 2001-10-24
Pages: 3
Assignors
FUJISAWA, MASAHIKO
Executed: 2001-10-03
MORIMOTO, NOBORU
Executed: 2001-10-03
OHSAKI, AKIHIKO
Executed: 2001-10-03
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JPX, JAPAN
Covered Property
(1)
Structure for Connecting Interconnect Lines with Interposed Layer Including Metal Layers and Metallic Compound Layer
Application:
09/978,005 →