IP Library › Assignment 012382/0179
Patent Assignment
Reel/Frame 012382/0179

Assignment of Assignor's Interest

Recorded: 2001-11-02 Pages: 2
Assignors
TENCH, D. MORGAN
Executed: 2001-11-02
WHITE, JOHN T.
Executed: 2001-11-02
Assignee
INNOVATIVE TECHNOLOGY LICENSING, LLC
P.O. BOX 1085, THOUSAND OAKS, CALIFORNIA, 91358
Covered Property (1)
Semiconductor Wafer Plating Cell Assembly
Patent: 6,989,084 →
Application: 10/012,079 →
Publication: US 2003/0085118
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Dec 4, 2006
From: INNOVATIVE TECHNOLOGY LICENSING, LLC
To: ROCKWELL SCIENTIFIC LICENSING, LLC
Reel/Frame 018573/0657 →
Change of Name Dec 4, 2006
From: ROCKWELL SCIENTIFIC LICENSING, LLC
To: TELEDYNE LICENSING, LLC
Reel/Frame 018573/0660 →
Merger Mar 9, 2012
From: TELEDYNE LICENSING, LLC
To: TELEDYNE SCIENTIFIC & IMAGING, LLC
Reel/Frame 027830/0206 →