IP Library Assignment 012395/0819
Patent Assignment
Reel/Frame 012395/0819

Assignment of Assignor's Interest

Recorded: 2001-12-27 Pages: 3
Assignors
DAVIDSON, RANDOLPH L.
Executed: 2001-07-31
BLEMBERG, ROBERT JOHN
Executed: 2001-07-31
Assignee
PECHINEY, EMBALLAGE FLEXBILE EUROPE
1 RUE DE L'UNION, 92843 RUEIL MALMAISON, FRANCE
Covered Property (1)
Hybrid Disk-Cone Extrusion Die Module Having a Spillover Surface Surrounding a Planar Seal Surface
Patent: 6,638,464 →
Application: 09/917,137 →
Publication: US 2003/0020206
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 16, 2010
From: ALCAN PACKAGING FLEXIBLE FRANCE
To: BEMIS COMPANY, INC.
Reel/Frame 024380/0968 →