IP Library Assignment 012417/0992
Patent Assignment
Reel/Frame 012417/0992

Assignment of Assignor's Interest

Recorded: 2002-01-02 Received: 2002-01-08 Pages: 3
Assignors
MAEDA, TAKEHIKO
Executed: 2001-08-23
ONO, YOSHIHIRO
Executed: 2001-08-23
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Property (1)
Resin encapsulated BGA-type semiconductor device
Application: 09/940,249 →