Patent Assignment
Reel/Frame 012419/0963
Assignment of Assignor's Interest
Recorded: 2001-10-22
Pages: 3
Assignee
ADVANCED CHIP ENGINEERING TECHNOLOGY, INC.
NO. 65, GUANGFU N. RD., HUKOU SHIANG, HSINCHU, TAIWAN 303 R.O.C., TAIWAN
Covered Property
(1)
Wafer level package and the process of the same
Application:
10/029,764 →
Publication:
US 2002/0160597