Patent Assignment
Reel/Frame 012421/0353
Assignment of Assignor's Interest
Recorded: 2001-12-21
Received: 2002-01-09
Pages: 3
Assignee
INTEL CORPORATION
2625 WALSH AVENUE, SANTA CLARA, CA, 95051, UNITED STATES
Covered Property
(1)
Underfill Process for Flip-Chip Device
Application:
10/032,115 →