IP Library › Assignment 012432/0220
Patent Assignment
Reel/Frame 012432/0220

Assignment of Assignor's Interest

Recorded: 2001-12-19 Pages: 3
Assignors
HORNG, GWO-JI
Executed: 2001-12-11
KUO, JEN-I
Executed: 2001-12-11
HSIAU, FENG-GER
Executed: 2001-12-11
Assignee
CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
CHIA-AN TSUN, LUNG-TAN, NO. 481, CHIA-AN TUAN, CHUNG-CHENG RD., TAOYUAN, R.O.C, TAIWAN
Covered Property (1)
Method of Fabricating a Ceramic Substrate with a Thermal Conductive Plug of a Multi-Chip Package
Patent: 7,222,419 →
Application: 10/034,030 →
Publication: US 2003/0110629
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 17, 2015
From: CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
To: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
Reel/Frame 035453/0240 →