Patent Assignment
Reel/Frame 012440/0760
Assignment of Assignor's Interest
Recorded: 2002-01-04
Received: 2002-01-14
Pages: 2
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, PALDAL-GU, SUWON-CITY, KYUNGKI-DO, KRX, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Having No Cracks in One or More Layers Underlying a Metal Line Layer and Method of Manufacturing the Same
Application:
10/035,247 →