Patent Assignment
Reel/Frame 012455/0799
Assignment of Assignor's Interest
Recorded: 2001-10-23
Received: 2002-01-16
Pages: 4
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, ID, 83707, UNITED STATES
Covered Properties
(2)
Flip-Chip with Matched Signal Lines, Ground Plane and Ground Bumps Adjacent Signal Bumps
Application:
10/037,637 →
Dense Phase Epoxidation
Application:
09/981,198 →