Patent Assignment
Reel/Frame 012461/0001
Assignment of Assignor's Interest
Recorded: 2002-01-09
Pages: 5
Assignor
OSG-LA, INC.
Executed: 2001-10-18
Assignee
WABASH TECHNOLOGIES, INC.
1375 SWAN STREET, HUNTINGTON, INDIANA, 46750
Covered Properties
(4)
Thick Film Ink Composition
Patent:
5,053,283 →
Application:
07/290,652 →
Thick-Film Circuit Element on a Ceramic Substrate
Patent:
5,169,465 →
Application:
07/646,266 →
Thick-Film Circuit Element
Patent:
5,702,653 →
Application:
08/500,547 →
Thermally Fused Resistor Having a Portion of a Solder Loop Thermally Connected to an Electrically Insulated Portion of an Outer Surface of the Resistor
Patent:
5,652,562 →
Application:
08/651,833 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Jul 2, 2003
From: WABASH MAGNETICS, LLC
To: BANK OF AMERICA, N.A. AS SENIOR CREDITOR AGENT
Reel/Frame 014210/0955 →
Notice of Grant of Security Interest
Jun 17, 2004
From: WABASH TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 014734/0930 →
Termination of Security Interest in Patents
Nov 16, 2007
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: WABASH TECHNOLOGIES, INC.
Reel/Frame 020119/0842 →
Termination of Security Interest in Patents
Dec 3, 2007
From: BANK OF AMERICA, N.A. AS SENIOR CREDITOR AGENT
To: WABASH TECHNOLOGIES, INC.
Reel/Frame 020186/0093 →
Termination of Security Interests in Patents
Dec 3, 2007
From: BANK OF AMERICA, N.A. AS SENIOR CREDITOR AGENT
To: WABASH MAGNETICS, LLC
Reel/Frame 020186/0142 →