Patent Assignment
Reel/Frame 012511/0267
Assignment of Assignor's Interest
Recorded: 2002-01-25
Pages: 3
Assignee
LEICA MICROSYSTEMS WETZLAR GMBH
ERNST-LEITZ-STRASSE 17-37, D-35578 WETZLAR, GERMANY
Covered Property
(1)
Apparatus and method for grasping and transporting wafers
Application:
10/012,028 →
Publication:
US 2002/0071745
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.