IP Library Assignment 012514/0526
Patent Assignment
Reel/Frame 012514/0526

Assignment of Assignor's Interest

Recorded: 2002-01-18 Received: 2002-01-31 Pages: 3
Assignor
COLLINS, ROBERT W.
Executed: 2001-08-08
Assignee
WINKLER & DUNNEBEIR, AG
SOHLERWEG 65,, D-56564 NEUWIED, DEX, GERMANY
Covered Properties (2)
Packaging Envelope and Method for Making the Same
Application: 09/925,440 →
Highly Conductive Molding Compounds for Use as Fuel Cell Plates and the Resulting Products
Application: 09/849,629 →