Assignment of Assignor's Interest

Recorded: 2001-10-23 Received: 2002-01-31 Pages: 2

Assignor

UEOKA, YOSHITO

Executed: 2001-10-16

Assignee

NEC CORPORATION

7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JPX, JAPAN

Covered Property (1)

Method of Forming Solder Bumps

Application: 10/047,172 →