Patent Assignment
Reel/Frame 012517/0559
Assignment of Assignor's Interest
Recorded: 2002-01-22
Received: 2002-01-31
Pages: 2
Assignor
ISHINODA, MUTSUO
Executed: 2001-12-12
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Apparatus for Sticking a Tape Onto a Semiconductor Wafer and Method of Sticking the Tape
Application:
09/975,561 →