IP Library Assignment 012517/0559
Patent Assignment
Reel/Frame 012517/0559

Assignment of Assignor's Interest

Recorded: 2002-01-22 Received: 2002-01-31 Pages: 2
Assignor
ISHINODA, MUTSUO
Executed: 2001-12-12
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Property (1)
Apparatus for Sticking a Tape Onto a Semiconductor Wafer and Method of Sticking the Tape
Application: 09/975,561 →