Patent Assignment
Reel/Frame 012535/0995
Assignment of Assignor's Interest
Recorded: 2002-01-28
Received: 2002-02-06
Pages: 2
Assignors
CHUNG-JU
Executed: 1999-11-23
LIN, WEI-FENG
Executed: 1999-11-23
TSAI, CHEN-WEN
Executed: 1999-11-23
Assignee
SILICON INTEGRATED SYSTEMS CORP.
SCIENCE-BASED INDUSTRIAL PARK, NO. 16, CREATION RD. 1, HSINCHU, TWX, TAIWAN
Covered Property
(1)
Bond Pad Structure and Its Method of Fabricating
Application:
10/056,004 →