IP Library Assignment 012535/0995
Patent Assignment
Reel/Frame 012535/0995

Assignment of Assignor's Interest

Recorded: 2002-01-28 Received: 2002-02-06 Pages: 2
Assignors
CHUNG-JU
Executed: 1999-11-23
LIN, WEI-FENG
Executed: 1999-11-23
TSAI, CHEN-WEN
Executed: 1999-11-23
Assignee
SILICON INTEGRATED SYSTEMS CORP.
SCIENCE-BASED INDUSTRIAL PARK, NO. 16, CREATION RD. 1, HSINCHU, TWX, TAIWAN
Covered Property (1)
Bond Pad Structure and Its Method of Fabricating
Application: 10/056,004 →