Patent Assignment
Reel/Frame 012544/0328
Assignment of Assignor's Interest
Recorded: 2002-01-29
Received: 2002-02-08
Pages: 3
Assignor
KODAMA, EISUKE
Executed: 2002-01-16
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Method for Forming an Interconnect Pattern in a Semiconductor Device
Application:
10/059,647 →