Patent Assignment
Reel/Frame 012550/0929
Assignment of Assignor's Interest
Recorded: 2002-01-28
Received: 2002-02-11
Pages: 4
Assignors
CHEN, SHIUH-HUI STEVEN
Executed: 2002-01-25
FIELD, CHERYL
Executed: 2002-01-25
LEFEBVRE, DIDIER R.
Executed: 2002-01-25
WANG, JOE PIN
Executed: 2002-01-25
Assignee
MOTOROLA, INC.
1303 EAST ALGONQUIN ROAD, SCHAUMBURG, IL, 60196, UNITED STATES
Covered Property
(1)
Method of Separating and Handling a Thin Semiconductor Die on a Wafer
Application:
10/058,650 →