Patent Assignment
Reel/Frame 012587/0521
Assignment of Assignor's Interest
Recorded: 2002-02-13
Received: 2002-02-22
Pages: 2
Assignor
HASEGAWA, TAKAO
Executed: 2002-01-22
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JPX, 100-8, JAPAN
Covered Property
(1)
Method of Wiring Semiconductor Integrated Circuit, Semiconductor Integrated Circuit, and Computer Product
Application:
10/073,328 →