Patent Assignment
Reel/Frame 012656/0910
Assignment of Assignor's Interest
Recorded: 2002-02-06
Received: 2002-03-13
Pages: 2
Assignors
DEGENKOLB, THOMAS A.
Executed: 2001-05-23
PEUGH, DARREL E.
Executed: 2001-05-23
SANFTLEBEN, HENRY M.
Executed: 2001-05-23
MEYERS, BRUCE A.
Executed: 2001-05-24
Assignee
DELPHI TECHNOLOGIES, INC.
LEGAL STAFF - MAIL CODE: 480-414-420, P.O. BOX 5052, TROY, MI, UNITED STATES
Covered Property
(1)
Corrosive Resistant Flip Chip Thermal Management Structure
Application:
10/079,760 →