Patent Assignment
Reel/Frame 012660/0094
Assignment of Assignor's Interest
Recorded: 2002-02-25
Received: 2002-03-14
Pages: 2
Assignor
IKEGAMI, GOROU
Executed: 2002-02-08
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Surface Mountable Chip Type Semiconductor Device and Manufacturing Method
Application:
10/083,998 →