Patent Assignment
Reel/Frame 012674/0197
Assignment of Assignor's Interest
Recorded: 2002-02-28
Pages: 11
Assignee
LASERDYNE LABS, INC.
1415 FOUNDATION PARK BLVD., S.E., PALM BAY, FLORIDA, 32909
Covered Properties
(5)
Method for Separating Non-Metallic Substrates
Patent:
6,420,678 →
Application:
09/240,058 →
Thermo-mechanical breaking of round, elliptical or annular shaped bodies
Application:
09/782,465 →
Publication:
US 2002/0108260
Brief summary of the invention
Application:
09/823,317 →
Publication:
US 2002/0170318
Methods for laser cut initiation
Application:
09/845,126 →
Publication:
US 2001/0035447
Method for sundering semiconductor materials
Application:
09/845,792 →
Publication:
US 2001/0035400
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 19, 1999
From: HOEKSTRA BRIAN L.
To: ACCUDYNE DISPLAY AND SEMICONDUCTOR SYSTEMS, INC.
Reel/Frame 010102/0850 →
Security Agreement
Aug 29, 2005
From: APPLIED PHOTONICS, INC.
To: INLIGN CPI, LLC
Reel/Frame 016674/0509 →
Amendment to Security Agreement
Sep 2, 2005
From: APPLIED PHOTONICS, INC.
To: INLIGN CP I, LLC
Reel/Frame 016712/0501 →
Release of Security Interests in Patents
Nov 2, 2005
From: APPLIED PHOTONICS, INC.
To: INLIGN CP I, LLC
Reel/Frame 016967/0432 →
Corrective Document to Correct the Assignor and Assignee, Previously Recorded on Reel 016967 Frame 0432. Assignor Hereby Confirms the Release of Security Interests in Patents.
Mar 13, 2006
From: INLIGN CP I, LLC
To: APPLIED PHOTONICS, INC.
Reel/Frame 017336/0131 →