Patent Assignment
Reel/Frame 012678/0527
Assignment of Assignor's Interest
Recorded: 2002-03-05
Received: 2002-03-19
Pages: 3
Assignors
FUKUDA, KEISUKE
Executed: 2002-02-21
KAMADA, SHIGERU
Executed: 2002-02-21
MEGURO, KOICHI
Executed: 2002-02-21
OHNO, TAKAO
Executed: 2002-02-21
SHIMOBEPPU, YUZO
Executed: 2002-02-21
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JPX, 211-8, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device Using Heated Conveyance Member
Application:
10/087,910 →