Patent Assignment
Reel/Frame 012694/0076
Assignment of Assignor's Interest
Recorded: 2002-03-06
Received: 2002-03-22
Pages: 5
Assignors
MANDELMAN, JACK A.
Executed: 2002-02-19
FILIPPI, RONALD G.
Executed: 2002-02-21
WACHNIK, RICHARD A.
Executed: 2002-02-25
GAMBINO, JEFFREY P.
Executed: 2002-03-05
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NY, 10504, UNITED STATES
Covered Properties
(2)
Electrically Porous on-Chip Decoupling/Shielding Layer
Application:
10/091,643 →
Method of Improving Retention and Drainage in a Papermaking Process Using Low Molecular Weight Cationic Dispersion Polymers
Application:
10/035,872 →