Assignment of Assignor's Interest

Recorded: 2002-05-20 Pages: 2

Assignor

ARAKI, CHIHIRO

Executed: 2002-05-14

Assignee

KABUSHIKI KAISHA MORIC

1450-6 MORI, SHUUCHI-GUN, JAPAN

Covered Property (1)

Semiconductor Chip Soldering Land Pattern

Patent: 6,841,887 →

Application: 10/063,854 →

Publication: US 2002/0179327

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.