Patent Assignment
Reel/Frame 012711/0566
Assignment of Assignor's Interest
Recorded: 2002-03-19
Received: 2002-03-28
Pages: 3
Assignors
NISHIDA, YUKIO
Executed: 2001-10-22
ODA, HIDEKAZU
Executed: 2001-10-22
OHTA, KAZUNOBU
Executed: 2001-10-22
SAYAMA, HIROKAZU
Executed: 2001-10-22
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
CHIYODA-KU, 2-3, MARUNOUCHI 2-CHOME, TOKYO 100-8310, JPX, JAPAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof
Application:
10/100,090 →