Patent Assignment
Reel/Frame 012749/0920
Assignment of Assignor's Interest
Recorded: 2002-04-01
Pages: 3
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JAPAN
Covered Property
(1)
Semiconductor device manufacturing method and semiconductor device
Application:
10/109,732 →
Publication:
US 2003/0032236