Patent Assignment
Reel/Frame 012750/0020
Assignment of Assignor's Interest
Recorded: 2002-03-28
Received: 2002-04-08
Pages: 3
Assignor
TOMIOKA, SATOSHI
Executed: 2002-03-08
Assignee
DENSEI-LAMBDA KABUSHIKI KAISHA
1-11-15, HIGASHI-GOTANDA, SHINAGAWA-KU, TOKYO, JPX, JAPAN
Covered Properties
(2)
On Board Mounting Electronic Apparatus and on Board Mounting Electric Power Supply
Application:
10/109,392 →
Semiconductor Wafer Arrangement and Method of Processing a Semiconductor Wafer
Application:
09/943,403 →